Here’s the way I’ve been flattening used
HSI chips with great success. A generic heating pad on high ( pad says it is 142-168 degrees Fahrenheit.
View attachment 604363
Lay 10 chips at a time in a single layer on 1/2 of the pad.
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Fold over the pad, avoiding a sharp crease in the pad.
View attachment 604367Heat for 10 minutes, sometimes holding the top of the pad down for good contact.
View attachment 604375Remove the chips and then using ceramic blanks, carefully align them and clamp in a hand clamp (very snugly but not SUPER tight). I used colored DDLM ceramics with no color transfer on either the ceramic or the
HSI chips. Blank ceramics would be preferable if available to remove all possibility.
Let cool 1-2 hours. Flat chips!