After having a frustrating morning of botched murder, this post from
@Nanook resolved most of my struggles.
Naboo’s one cut method saved me.
Starting about 1/8” from the edge, I make an incision only about 1/4” long toward the center.
Using an X-acto, I try to slip the tip of the blade under both the laminate and the vinyl layers.
I then turn the blade slightly while trying to drive it (gently) further under both layers, then lifting.
The goal is to create a small pouch or pocket for the X-acto to lift from. Using only one cut gives more leverage.
One the inlay begins to lift from the chip, I can start to pull from the edge, following the circumference. I keep my lifting finger on the chip so that it doesn’t tear into smaller pieces.
If done right, you can usually (not always) get the whole inlay up with a slow circular pull.
It seems crucial with these vinyl inlays not to separate the two layers. Once the laminate is lifted off on its own, you’re in a world of hurt.
The vinyl on my victim chips was not weighty enough to pull off in large chunks on its own. When connected to the laminate, the full inlay holds together enough to tug against the adhesive without tearing or breaking.
Without the laminate attached, I wound up having to scrape off a lot of medium to tiny pieces of vinyl, bit by bit. This is not only extremeky slow, but results in potentially more damage to the clay. If you can get it off in one piece, the tile savings is huge.
Learning how deep to cut to get through the laminate and vinyl layers without cutting into the clay takes practice; can’t say I’m there yet.